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Electron Microscopy Sciences Precision Diamond Wafer Blade 4", Coarse grit with High Concentration, 0.012" thick

Supplier:  Electron Microscopy Sciences 50265CH4

Encompass_Preferred

These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements. A high concentration of coarse diamond particles is for general laboratory use with low or high saw's speed.
Particles: Coarse
Concentration: High
Thickness: 0.012"

Catalog No. 50-997-187


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